[AR] Re: "How Hard Can It Be" rocket episode
- From: Ben Brockert <wikkit@xxxxxxxxx>
- To: "arocket@xxxxxxxxxxxxx" <arocket@xxxxxxxxxxxxx>
- Date: Wed, 20 Nov 2013 15:43:42 -0700
There's a Kickstarter (of course) for a machine that can make flexible
circuits via an additive process:
http://www.kickstarter.com/projects/cartesianco/the-ex1-rapid-3d-printing-of-circuit-boards
Though I expect that substrate selection and proving durable adhesion
would end up costing more than just buying flexible circuits for a
small project.
The mechanical guy on it had the little peroxide VTVL project in Australia.
Ben
On Wed, Nov 20, 2013 at 2:56 PM, <johndom@xxxxxxxxx> wrote:
> Thin flexible multilayer PCBs are available since the seventies. Applied in
> most NATO jets circuitry. Allow for 90° bends. Mylar I think. Not sure about
> 180° folding them (from international aerospace exhibitions visits, like
> Farnborough and Le Bourget).
>
> So I wonder if flex ones crack too.
>
>
>
> jd
>
>
>
> ________________________________
>
> Van: arocket-bounce@xxxxxxxxxxxxx [mailto:arocket-bounce@xxxxxxxxxxxxx]
> Namens George Herbert
> Verzonden: woensdag 20 november 2013 22:17
> Aan: arocket@xxxxxxxxxxxxx
> Onderwerp: [AR] Re: "How Hard Can It Be" rocket episode
>
>
>
> I'm more worried about boards cracking, solder joints between chips / SMT
> components and the board cracking, etc.
>
>
>
> On Wed, Nov 20, 2013 at 1:13 PM, Keith Henson <hkeithhenson@xxxxxxxxx>
> wrote:
>
>> From: George Herbert <george.herbert@xxxxxxxxx>
>
> snip
>
>
>> Some of my lawn-dart style manned capsule landers kept G-loads to 10 Gs or
>> less for the crew. That should be within tolerance bands for electronics,
>> though one needs to look at the specific equipment.
>
> Back in the early 70s part of the testing protocol was to spin bonded
> chips at 10,000 g upside down to test that the bonding wires didn't
> come off.
>
>
>
>
>
> --
> -george william herbert
> george.herbert@xxxxxxxxx
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