Henry Spencer wrote:
Recovering the electronics package sufficiently intact to get the data out is one thing; treating it gently enough that you can still depend on it for future flights is a rather more demanding requirement, and a somewhat ill-defined one too.
QFP and similar packages tend to break their leads at the case/pin junction after having been vibration loaded. LCCs don't like too many temperature cycles. Another issues is resonant pcb mountings. uwe
