[AR] Re: "How Hard Can It Be" rocket episode
- From: George Herbert <george.herbert@xxxxxxxxx>
- To: "arocket@xxxxxxxxxxxxx" <arocket@xxxxxxxxxxxxx>
- Date: Wed, 20 Nov 2013 13:17:19 -0800
I'm more worried about boards cracking, solder joints between chips / SMT
components and the board cracking, etc.
On Wed, Nov 20, 2013 at 1:13 PM, Keith Henson <hkeithhenson@xxxxxxxxx>wrote:
> > From: George Herbert <george.herbert@xxxxxxxxx>
>
> snip
>
> > Some of my lawn-dart style manned capsule landers kept G-loads to 10 Gs
> or
> > less for the crew. That should be within tolerance bands for electronics,
> > though one needs to look at the specific equipment.
>
> Back in the early 70s part of the testing protocol was to spin bonded
> chips at 10,000 g upside down to test that the bonding wires didn't
> come off.
>
>
--
-george william herbert
george.herbert@xxxxxxxxx
Other related posts:
