[AR] Re: Electroforming Experiment
- From: Peter Fairbrother <peter@xxxxxxxxxx>
- To: arocket@xxxxxxxxxxxxx
- Date: Mon, 15 Jul 2019 00:36:03 +0100
Aaargh, some corrections:
On 14/07/2019 21:51, Peter Fairbrother wrote:
the most usual form of electroless copper uses sodium hypophosphite are
the reducing agent rather than formaldehyde. Use of formaldehyde is
uncommon
I just learned that the use of formaldehyde copper became the preferred
method for PTH (plated-through-holes) from about 1990-2010, after the
formaldehyde process was improved in ca 1990 [*] - back in my day, the
70's, it was all hypophosphite - though the PTH guys are now going back
to hypophosphite.
Hypophosphite is still the most common reducing agent for other metals
though.
[*] they added a bit of nickel and used formaldehyde instead of
hypophosphite, which increased adhesion.
solubility of copper sulphate pentahydrate in water, which is
above 30 g/l at all useful temperatures
should read 300g/l, not 30 g/l (!)
Peter Fairbrother
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