On the getting the cooling channels into the chamber front. Would it be
possible to print the cooling channels into the initial form. Electroform
the channels and the exterior surface onto the form. Then as the secondary
step, remove/burnout the printed form; and then closeout the inside of the
chamber? Or is plating internal structures a no-go?
On Sun, Jul 14, 2019 at 7:11 PM Ed LeBouthillier <codemonky@xxxxxxxxxxxxx>
wrote:
Here's another reference that suggest similar values to what Peter has
suggested:
Modelling and Optimization of Copper Electroplating Adhesion Strength
https://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017
