[AR] Re: Electroforming Experiment

  • From: Ed LeBouthillier <codemonky@xxxxxxxxxxxxx>
  • To: arocket@xxxxxxxxxxxxx
  • Date: Sun, 14 Jul 2019 20:10:39 -0700

Here's another reference that suggest similar values to what Peter has
suggested:

Modelling and Optimization of Copper Electroplating Adhesion Strength
https://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017




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