[AR] Re: Electroforming Experiment
- From: Ed LeBouthillier <codemonky@xxxxxxxxxxxxx>
- To: arocket@xxxxxxxxxxxxx
- Date: Sat, 13 Jul 2019 14:18:10 -0700
On Sat, 2019-07-13 at 20:38 +0100, Peter Fairbrother wrote:
Also: (about 0.04 Amps/sqin)
First impressions: Copper level is ok; not enough acid; current too
low; too many additives.
Thanks. I don't have a pH meter yet.
The copper level is about medium. As you are not using very high
currents or acid concentrations, this is fine.
Do you know of any good general sources on setting up plating
parameters? I found a NASA pub:
Investigation of Electroforming Techniques
http://hdl.handle.net/2060/19760013393
It touches on some of the things you've mentioned. Are there any
industry standard documents that would be helpful?
Did you mean 80 ml of H2SO4? 60ml might be more appropriate, but 8ml
is just too little. Insufficient acid limits the maximum current,
and except at very low currents makes the deposits spongy and
occludes copper salts in the deposit.
I was using 8 ml of acid.
946 ml distilled water
227 grams Copper Sulfate
8 ml Sulfuric Acid
Some typical baths, in g/l:
Thanks...I'll improve my bath.
Too low current causes large grain sizes.
Typical cathode current densities:
Thanks, I'll look into it.
Other related posts:
